Application Engineer Director

Position: Director of Application Engineering

Position Summary

The Director of Application Engineering is a senior technical leadership role responsible for defining and driving global application engineering capabilities in the high-performance electronics industry.
This position leads a team of technical experts and serves as a key decision-maker in PCB stack-up architecture, materials selection, signal integrity, thermal performance, and qualification strategies. 

Key Responsibilities

Technical Leadership & Decision Making

• Provide technical direction and final approval on complex PCB stack-up designs, material choices, and performance trade-offs.

• Guide technical risk assessment and ensure design solutions meet reliability, manufacturability, and performance targets.

• Act as the senior technical authority during critical design-in and escalation situations.

Application Engineering Strategy

• Define and execute the global application engineering roadmap aligned with product strategy and future technology trends.

• Drive standardization of design methodologies, simulation practices, and qualification approaches across regions.

• Influence product development by translating field and customer technical needs into actionable technical requirements.

Cross-Functional Collaboration

• Partner with R&D, Product Management, Manufacturing, and Sales to align on technical capabilities and development priorities.

• Support new material and technology introductions through early technical evaluation and validation planning.

• Ensure seamless technical communication between internal teams and external partners.

Team Leadership & Talent Development

• Lead, mentor, and develop a global team of application engineers and technical specialists.

• Build technical depth, problem-solving capability, and succession planning within the organization.

• Establish scalable processes for stack-up modeling, simulation, testing, and failure analysis.

Technology & Industry Engagement

• Maintain deep expertise in advanced PCB materials, including high-speed, low-loss, and thermally enhanced solutions.

• Represent the company in industry standards committees and technical forums.

• Stay ahead of emerging technologies, industry standards, and qualification requirements.

Qualifications & Experience

• 15+ years of experience in application engineering, design engineering, or materials engineering within high-reliability electronics industries.

• Proven experience working with global PCB or laminate manufacturers and advanced interconnect technologies.

• Strong understanding of industry qualification standards, reliability testing, and failure analysis methodologies.

• Demonstrated ability to lead technical teams and influence cross-functional stakeholders.

Education

• Bachelor’s degree or higher in Electrical Engineering, Materials Science, Mechanical Engineering, or a related technical discipline.
  
  To apply it, please send me your resume to christine.chen@morganphilips.com