Job Description – Business Development Manager (Semiconductor Packaging)

Role Overview

This role focuses on engagement with fabless semiconductor companies, particularly in Advanced Packaging and Automotive Packaging. The ideal candidate must bring hands-on semiconductor packaging experience (traditional or advanced) and a solid technical background in areas such as Application Engineering, Process Engineering, Process Integration, or Product Engineering within the semiconductor industry.

Key Responsibilities

• New Business Development: Identify, approach, and secure new customers in automotive electronics and fabless design houses, promoting differentiated semiconductor packaging solutions.

• Customer Requirement Analysis: Assess customer technical and product needs; coordinate with internal PD, AE, and technical teams to evaluate feasibility and design customized solutions.

• Technical–Business Integration: Partner with customer R&D and product teams to align packaging technologies with business requirements, delivering competitive proposals and value propositions.

• Market & Competitive Intelligence: Track semiconductor packaging technology trends (e.g., 2.5D/3D, SiP, automotive-grade packaging), monitor competitor strategies, and analyze material cost trends to inform strategy.

• Partnership Development: Build strategic collaborations with foundries, OSATs, module providers, material suppliers, and automotive system integrators.

• Performance Tracking: Manage CRM pipeline, monitor project progress, and deliver regular reports on sales forecasts, wins, and performance metrics.

Key Success Metrics

• Growth in fabless/automotive packaging customer pipeline and engagement.

• Project win rate and achievement of sales targets.

• Effective collaboration with internal stakeholders (GKAMs, AE/PD, Marketing) and external partners (OSATs, foundries, integrators).

Qualifications

• Education: Bachelor’s degree or above in Materials Science, Chemical Engineering, Electrical Engineering, or a related field.

• Experience:

  • 3–5 years of proven experience in semiconductor packaging (MUST – traditional or advanced).

  • Technical background in Application Engineering, Process/Integration Engineering, or Product Engineering within semiconductor fabs, OSATs, or packaging houses.

  • Experience with packaging material sales, advanced packaging solutions, or fabless/automotive engagement preferred.

• Skills:

  • Strong technical communication skills; able to translate engineering concepts into business value.

  • Solid project management, proposal development, and customer relationship management abilities.

  • Proficiency with CRM tools and sales pipeline management.

  • Fluent in English, with prior exposure to international customers an advantage.