Director, FAE & Fab Integration (Advanced Packagin

We’re seeking an experienced Director of FAE & Fab Integration for a US-based Semiconductor material company. This role is the bridge between our client’s process and device teams and the foundry's engineering organization, driving the material from qualification through to volume production. The ideal candidate has deep semiconductor process integration experience, a track record of getting new materials qualified inside a Taiwanese foundry, and the credibility to be taken seriously by their engineers. They are self-directed and comfortable operating independently.
 
Key Responsibilities

• Own how the company’s substrates behave within the foundry's process flow, including handling, thermal budget, metrology compatibility, and performance through, deposition, CMP, bonding and packaging methodologies.
• Support the customer's qualification program through test plans, splits, lot dispositioning, and the data package required for production release.
• Lead failure investigations from the supplier side, determining whether an excursion originates in our material or their process, and returning with evidence rather than opinion.
• Manage change control in both directions, assessing the impact of customer process changes on our material and driving any change to ours through their approval process.
• Own quality at the customer interface, including incoming inspection criteria, excursion response, 8D, and corrective action to the customer's standard.
• Serve as the primary technical interface between the company’s Bay Area teams and the customer's engineering organization, and act as the escalation path when commitments slip in either direction.

 
Required Qualifications

• 10+ years of experience in semiconductor manufacturing, with demonstrated depth in both process integration and foundry operations.
• 5+ years working inside or supplying a leading-edge Taiwanese logic foundry, with a track record of qualifying a material or process into volume production.
• Strong process knowledge across the primary module groups, sufficient to lead a yield investigation and engage credibly with module owners.
• Proven experience owning the supplier side of a customer qualification, including data packages, audits, corrective actions, and sustained technical scrutiny.
• Experience introducing novel material into an established fab flow, or background in compound semiconductors, wafer bonding, or advanced packaging, is highly desirable.
• Fluency in Mandarin and English, with the judgment to know when to push back on a customer requirement and when to absorb it.
• Degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related discipline; advanced degree is a plus.

 
For more information and a confidential conversation, please email your CV to Janet.Yeh@morganphilips.com. Please note that while Morgan Philips welcomes and appreciates all candidate response, volume of replies allows us to respond to short-listed candidates only. Resumes are collected for recruitment purposes only.