Principal Engineer, Connector

Role Summary

Reporting directly to engineering leadership, the Principal Development Engineer will spearhead the electrical and mechanical optimization of advanced connector interfaces, cable-to-connector assemblies, and cable-to-PCB interfaces for our client’s cutting-edge high-speed interconnect product portfolio. This individual will drive the interconnect architecture from early concept through high-frequency electromagnetic simulation (HFSS), Proof-of-Life (PoL) validation, and rigorous laboratory measurement. By partnering closely with silicon, systems, mechanical, and customer-facing teams, you will deliver high-performance, signal-integrity-optimized, and highly manufacturable interconnect solutions.

Key Responsibilities

• End-to-End Interconnect Ownership: Drive the complete optimization lifecycle of connectors, cable-to-connector assemblies, and cable-to-PCB interfaces for high-speed products.

• Architecture & Conceptual Design: Lead the conceptual design and architecture definition for next-generation connector and cable interconnect systems, rigorously evaluating electrical, mechanical, and manufacturability trade-offs.

• Simulation & Modeling: Build, execute, and refine advanced Ansys HFSS simulation models to characterize and optimize the electrical performance of connectors, cables, and PCB launch structures.

• Proof-of-Life (PoL) Validation: Define and execute structured PoL studies to validate design intent, structural integrity, and electrical performance prior to full-scale qualification.

• Laboratory Characterization & Debugging: Perform and oversee sophisticated lab measurements (utilizing VNAs, TDRs, and high-speed oscilloscopes) to validate simulation predictions, correlate data, and resolve performance bottlenecks.

• Technical Leadership & Design Reviews: Drive cross-functional design reviews, delivering expert technical recommendations to engineering leadership, product management, and key enterprise clients.

• Cross-Functional Collaboration: Partner seamlessly with signal integrity, mechanical, package, systems, manufacturing, and customer support teams to align interconnect designs with overarching product specifications.

• Vendor & Supply Chain Engagement: Collaborate directly with premier connector and cable suppliers to oversee design-in, sample building, qualification, and mass-production manufacturability.

• Mentorship: Guide and mentor junior engineering talent in simulation methodologies, lab measurement techniques, and industry-best interconnect design practices.

• Specialized Projects: Execute individual technical objectives and strategic initiatives defined by the executive team on a project-by-project basis.

Required Experience

• Experience: Minimum of 10+ years of progressive engineering experience focused on high-speed interconnects, advanced connectors, or cable assembly development within the semiconductor, networking, or high-performance computing sectors.

• Domain Expertise: Proven track record of successfully optimizing connector, cable-to-connector, and cable-to-PCB interfaces for ultra-high-speed differential signaling applications (e.g., PCIe, high-performance SerDes, 112G+/224G electrical interfaces).

• Simulation Proficiency: Extensive hands-on expertise with Ansys HFSS (or equivalent 3D full-wave electromagnetic field solvers) for complex connector and cable modeling.

• Architecture & Feasibility: Demonstrated history of leading conceptual design and architecture definition for novel interconnect systems from early feasibility to detailed production design.

• Validation & Testing: Demonstrated experience planning and executing Proof-of-Life (PoL) studies to ensure first-pass electrical and mechanical reliability.

• Lab Competency: Strong laboratory background featuring hands-on mastery of VNAs, TDRs, and real-time oscilloscopes for channel characterization.

• Ecosystem Collaboration: Experience interfacing directly with mechanical, SI, and manufacturing engineering teams, as well as engaging external component vendors on design-in and qualification trade-offs.

Required Skills & Competencies

• Signal Integrity Fundamentals: Deep, foundational mastery of high-speed signal integrity principles, including S-parameters, transmission line theory, impedance control, crosstalk minimization, and insertion/return loss optimization.

• Analytical Correlation: Exceptional analytical capability to bridge simulation models with empirical lab data and rapidly resolve discrepancies.

• System Translation: Proven ability to translate complex system-level electrical requirements into clear, actionable component specifications.

• Communication & Influence: Outstanding cross-functional communication and stakeholder management skills, with the ability to build consensus and guide design trade-offs across multidisciplinary teams.

• Program Execution: Ability to manage multiple concurrent development streams and prioritize effectively under aggressive time-to-market schedules.

• Methodology: Working knowledge of Lean Product Development (Lean PD) principles to streamline iteration cycles and reduce engineering waste.

• Language Requirements: Fluency in written and spoken English is essential. Mandarin language proficiency is considered a strong asset to facilitate seamless collaboration with regional supply chain partners and customers.

• Travel: Ability and willingness to travel internationally as required for supplier reviews, lab bring-ups, and key customer engagements.

Education

• Degree: Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, or a closely related technical field.

• Specialization: Advanced coursework, graduate research, or demonstrated specialized expertise in electromagnetics, RF/microwave engineering, or high-speed signal integrity is strongly preferred.