Principal 2.5D/3D Packaging Engineer

【The Role】

This strategic leadership position offers immense visibility, setting the direction for the Advanced 2.5D/3D and 3D-IC packaging segments across the organization’s global portfolio. As a key member of the Technology and Innovation group, you will evaluate long-term industry shifts and customer requirements across all aspects of advanced packaging. You will provide the technical leadership necessary for defining new product requirements, driving strategic partner engagements, and offering high-level guidance to solve the most critical challenges facing the advanced semiconductor packaging industry. A primary focus will be identifying and securing growth opportunities within emerging advanced markets.

【Key Responsibilities】

• Technology Strategy: Drive the corporate strategy for advanced packaging to ensure market-leading performance, measured by New Product Revenue (NPR) and strategic program success.

• Market Intelligence: Identify technical bottlenecks within the Advanced Packaging landscape where the company can gain a competitive edge; develop technology-led strategies to enter new market segments.

• Stakeholder Alignment: Determine the technical needs of strategic customers and communicate the business implications to internal divisional stakeholders.

• Partnership Management: Create and execute technical engagement initiatives for key customers and external research partners.

• Cross-Divisional Synergy: Align internal product development activities with global customer expectations and roadmaps.

• Collaborative Leadership: Drive cross-functional projects by engaging R&D engineers, technologists, and senior business leaders to ensure a unified approach to advanced packaging solutions.

【Candidate Requirements】

• Education: Master’s degree in Engineering, Physics, Materials Science, or a related technical field (PhD preferred).

• Experience: 10+ years of professional experience as a Packaging or Integration Engineer, specifically focused on Advanced Packaging architecture and process flow.

• Domain Expertise: Comprehensive knowledge of the advanced packaging landscape and a track record of contributing to technical literature/presentations.

• Execution: Proven project management skills with a history of planning and executing high-impact technical projects.

• Communication: Exceptional ability to translate complex technical materials into strategic presentations for both internal executives and external clients.