1 研發、技術、營運和工程 職務 Tainan

【Position Summary】 We are seeking a visionary and results-driven leader to spearhead our Advanced Packaging division. This pivotal role is responsible for defining the technology roadmap, driving R&D breakthroughs in next-generation architectures (2.5D/3D, Fan-Out, Chiplet), and managing high-level relations...