Manufacturing Engineer (Surface Mount)
發佈於: 2026/1/14
Taipei Northern Taiwan
Permanent
零售
Role Overview
We are seeking a high-energy, hands-on Process Engineer to join our manufacturing team. This role is critical in developing and optimizing high-volume Surface Mount Technology (SMT) processes that meet rigorous reliability and performance standards. You will be responsible for the end-to-end health of our assembly lines, from initial programming and profiling to advanced statistical process control and design for manufacturability (DFM).
Key Responsibilities
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Process Development: Design and implement SMT processes tailored for high-volume manufacturing, ensuring all high-reliability and product performance requirements are met.
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Continuous Improvement: Drive measurable improvements in process capability ($C_{pk}$) by utilizing Statistical Process Control (SPC) and structured problem-solving methodologies.
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Failure Analysis: Identify failure mechanisms in SMT materials and assembly processes. Formulate and execute rapid-response solutions to improve yield, reliability, and manufacturability under tight deadlines.
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Technical Programming (Hands-on): Directly create and optimize programs for solder paste/flux printing, Automated Optical Inspection (AOI), Solder Paste Inspection (SPI), and thermal reflow profiling.
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Cross-Functional Collaboration: Partner with Design, Quality, and Operations teams to ensure new products are optimized for production.
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DFM Reviews: Lead and participate in Printed Circuit Board (PCB) design reviews with a focus on Design for Manufacturability (DFM).
Minimum Requirements
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Education: BS in Mechanical, Chemical, or Industrial Engineering.
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Experience: 5+ years of direct experience in Surface Mount Technology (SMT),
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Technical Proficiency: * Deep understanding of high-volume SMT equipment, materials, and "world-class" assembly standards.
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Expertise in Minitab (or similar statistical software) and advanced Excel.
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Proven track record of improving yields, throughput, and Cpk in a production environment.
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Practical Skills: Demonstrated ability to create printing programs, SPI/AOI programs, and reflow profiles.
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Methodologies: Strong knowledge of SPC, Design of Experiments (DOE), and Six Sigma tools (FMEA, Control Plans) to prevent and solve technical issues.
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Soft Skills: Independent, creative thinker who thrives in a fast-paced environment; excellent written and verbal communication skills.
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Preferred: Experience with ASM Siplace Pick and Place equipment is a plus.