Technical Director, Advanced Package

【Position Summary】

We are seeking a seasoned and visionary (Sr.) Technical Director to lead R&D efforts within our Advanced Packaging Technology Team. This high-impact leadership role drives the development and optimization of next-generation packaging technologies, serving as the primary technical interface to a world-leading Tier-1 Foundry's Advanced Packaging group across both R&D and high-volume manufacturing (HVM) sites.

As part of one of our fastest-growing global divisions, this position offers high visibility, direct engagement with executive leadership, and significant growth potential. You will lead multiple high-stakes R&D projects—from early-stage evaluations and first-in-fab demonstrations to strategic technology roadmap planning—while collaborating closely with internal business units and key customer stakeholders.

【Key Responsibilities】

• Technical Leadership: Direct the development, optimization, and deployment of cutting-edge advanced packaging technologies.

• Strategic Liaison: Act as the primary technical interface to the customer’s Advanced Packaging leadership, supporting both tactical execution and long-term strategic initiatives.

• Customer Engagement: Drive high-level engagement through equipment/process demos, early learning systems, and first-in-fab project successful delivery.

• Voice of the Customer (VoC): Lead regular Technical Review Meetings (TRM); serve as the technical "Voice of the Customer" to positively influence internal product development roadmaps at the early design phases.

• Integration & Excellence: Collaborate with senior customer stakeholders to align technology roadmaps, resolve complex integration challenges, and improve yield, productivity, and cost efficiency.

• Mentorship & Culture: Build and mentor a high-performing technical team, fostering a culture of innovation and cross-functional collaboration.

• Strategic Planning: Contribute to long-term technology roadmaps and strategic planning for global advanced packaging solutions.

• Process Standardization: Introduce and implement new analytical methodologies to enhance process control and global standardization.

【Candidate Profile】

• Education: Master’s or Ph.D. degree in Materials Science, Chemical Engineering, Electrical Engineering, or a related technical field.

• Industry Experience: 15+ years of experience in the semiconductor industry, with a deep focus on Advanced Packaging R&D.

• Project Leadership: A proven track record in New Product Introduction (NPI) and leading cross-functional technical programs.

• Stakeholder Management: Demonstrated success in technical project management and customer engagement, particularly with development-stage technologies.

• Team Management: Exceptional leadership capabilities with the ability to grow and mentor high-performing technical teams.

• Communication: Excellent communication skills in English; Mandarin proficiency is required for technical and strategic discussions.