Engineering Director – Product & Test Infrastructure

We are looking for an executive leader to take ownership of our global Product & Test Engineering organization. In this position, you will drive operational excellence across the entire IC development continuum—guiding silicon from initial prototype validation to high-volume manufacturing, yield optimization, and long-term product lifecycle management.

You will work closely with cross-functional executive teams and external foundry/OSAT partners to ensure market-leading quality, optimal cost structures, and seamlessly scalable production execution.

Core Responsibilities

People & Strategic Leadership

• Global Team Empowerment: Guide, build, and mentor multi-site test and product engineering teams across different regions.

• Operational Excellence: Cultivate an enterprise culture focused on technical rigor, proactive accountability, and systematic process enhancement.

• Leadership Development: Provide structured mentorship to engineering managers and principal architects to establish a robust succession pipeline.

Product Engineering & Lifecycle Operations

• Silicon Enablement & NPI: Oversee comprehensive product engineering roadmaps from first-silicon bring-up and characterization through to full qualified volume release.

• Yield & Margin Optimization: Spearhead cross-site initiatives to systematically increase wafer/die yields, decrease unit cost, and enforce stringent quality baselines.

• Sustaining Strategy & RMA: Partner with global quality groups to address complex technical queries, driving thorough root-cause investigations and 8D corrective actions.

Test Architecture & Manufacturing Scalability

• Automated Test Solutions: Direct the strategic rollout of production test hardware/software solutions for complex integrated circuits.

• Cost of Test (CoT) Reduction: Continuously optimize test coverage, execution throughput, and test-time metrics without sacrificing fault coverage.

• Supply Chain & OSAT Transfer: Oversee global test house scalability, outsourced manufacturing operations, and seamless test-solution migration across partners.

Cross-Functional & Ecosystem Alignment

• Design-for-X (DFX): Champion early-stage DFT/DFQ frameworks in partnership with Design, Package, and Systems groups to ensure upstream manufacturability.

• Ecosystem Management: Direct operational alignment between internal design teams, reliability labs, foundry operations, and OSAT suppliers.

Candidate Qualifications

• Education: B.S. in Electrical/Electronics Engineering or a related technical discipline (M.S. or Ph.D. preferred).

• Industry Experience: 15+ years of progressive technical and management experience within the semiconductor sector.

• Leadership Expertise: 8+ years in senior-level engineering management with proven experience leading international, multi-site teams.

• Technical Depth: Deep understanding of silicon manufacturing workflows, wafer fab processing, package qualification, and high-volume semiconductor operations.

• Product Domain: Track record supporting advanced semiconductor solutions (e.g., analog, mixed-signal, power, or automotive IC architectures).

• Program Execution: Demonstrated success in orchestrating multi-functional product delivery pipelines from concept to mass production.