Sr. Director/VP of Advanced Package

【Position Summary】

We are seeking a visionary and results-driven leader to spearhead our Advanced Packaging division. This pivotal role is responsible for defining the technology roadmap, driving R&D breakthroughs in next-generation architectures (2.5D/3D, Fan-Out, Chiplet), and managing high-level relationships with global Tier-1 customers. The ideal candidate combines deep technical expertise with a strong business acumen to ensure technological leadership and sustainable profitability.

【Key Responsibilities】

I. R&D Strategy & Technical Leadership

• Technology Roadmap: Define and execute the long-term strategic roadmap for advanced packaging, focusing on 2.5D/3D IC, Fan-Out, Chiplet, and heterogeneous integration.

• Innovation to Mass Production: Lead the R&D team to achieve technical breakthroughs in critical processes, materials, and architectures, ensuring a seamless transition from lab to high-volume manufacturing (HVM).

• Ecosystem Collaboration: Partner with equipment and material suppliers to co-develop cutting-edge solutions aligned with future industry trends.

II. Customer Engagement & Technical Integration

• Strategic Liaison: Serve as the primary technical point of contact for global key accounts (IDMs and leading Fabless firms), fostering long-term collaborative partnerships.

• Problem Resolution: Address complex customer technical challenges, enhancing product reliability and process stability to meet stringent industry standards.

III. Business Development & Strategic Partnerships

• New Project Acquisition: Spearhead potential client engagement plans and drive the implementation of new high-impact projects.

• Market Alignment: Collaborate with Sales and Marketing teams to deliver advanced packaging solutions, leading technical presentations and strategic project proposals.

• Trend Analysis: Monitor global market shifts to identify opportunities for strategic alliances and technical co-operations.

IV. Operations & Cost Management

• Cost Modeling: Establish comprehensive cost structure models for various stages of advanced packaging to evaluate the feasibility and ROI of new technologies.

• Operational Excellence: Continuously optimize material, process, and equipment configurations to reduce Total Manufacturing Cost (TMC).

• Cross-functional Synergy: Partner with Manufacturing, Supply Chain, and Finance teams to ensure all projects achieve target margins and cost objectives.

【Candidate Profile】

• Industry Experience: 20+ years of professional experience in the semiconductor industry with a proven track record in executive leadership.

• Technical Mastery: Deep expertise in 2.5D/3D IC, Fan-Out, and Chiplet architectures. Must have led large-scale advanced packaging projects from initial concept through to successful mass production.

• Customer Track Record: Demonstrated success in collaborating and negotiating with international Tier-1 clients (e.g., major US/Japan-based IC design firms).

• Domain Knowledge: Solid understanding of technical requirements and trends in AI, High-Performance Computing (HPC), and Automotive sectors.

• Business Acumen: Strong capability in strategic planning, cost analysis, and cross-functional coordination. Familiarity with the advanced packaging supply chain and complex cost structures is essential.

• Language: Fluency in English and Mandarin for high-level technical and business negotiations.