TD Manager

As a TD Manager, you will lead the Technology Development department, taking ownership of process technology innovation, platform strategic planning, and the introduction of next-generation technologies. This role is pivotal in maintaining manufacturing competitiveness and ensuring the long-term success of the product roadmap.

Key Responsibilities

• Technology Strategy & Roadmap Lead the engineering team in defining long-term process strategies, platform development, and technical directions to maintain a competitive edge.

• Process Integration & Optimization Drive continuous improvement in process integration and optimization, focusing on yield enhancement and stabilizing production during high-volume ramp-ups.

• Technical Authority Serve as the primary technical decision-maker for complex process architectures and device integration challenges, providing expert guidance and solutions.

• Cross-Functional Synergy Collaborate seamlessly with Manufacturing, Equipment, Metrology, Quality, and Sales teams to align development goals with operational execution.

• Customer-Centric Technical Support Engage with key customers for technical evaluations, manage New Product Introductions (NPI), and oversee the resolution of critical technical issues.

• Organizational Leadership Strategize team structure, manage resource allocation, and drive talent development to increase the organization’s technical depth and execution excellence.

Required Skills and Qualifications

1. Education

• Master’s degree or higher in Electrical Engineering, Electronic Engineering, Physics, or a related semiconductor field.

2. Experience

• Industry Experience: 15+ years of professional experience within the semiconductor industry.

• Functional Expertise: 10+ years of hands-on expertise in Technology Development (TD) and/or Process Integration Engineering (PIE).

• Management Provenance: 5+ years in a leadership capacity, managing engineering teams and steering technical decision-making processes.

3. Technical Proficiency

Profound knowledge of semiconductor wafer fabrication processes, equipment, and metrology. Preferred candidates will have experience in multiple technology platforms:

• Analog & Power: BCD, HVCMOS, Bipolar IC.

• Power Discretes: Planar / Trench Schottky, FRED, Transistors, Zener diodes.

• Optoelectronics: Photo Transistors, Photo Triac, PVG.

• Next-Gen Materials: SiC (Silicon Carbide) devices.

4. Professional Competencies

• Leadership & Problem Solving: Exceptional leadership presence with a strong sense of ownership and analytical problem-solving skills.

• Project Management: Demonstrated ability to manage multiple complex projects independently in a fast-paced environment.

• Communication & Language:

  • English: Fluent/Proficient (Required).

  • Japanese: Professional proficiency is a significant advantage.