Senior Director, Technology Development

Sr. Director, Technology Development
Location: Hsinchu, Taiwan
 
Confidential Search - We are seeking a Senior Director of Technology Development for a leading Fabless company to lead its TD, Product & Testing organizations. In this critical executive role, he/she will lead a large-scale, cross-functional engineering team to develop and optimize next-generation BCD technology platforms and high-performance Power ICs. This role will own the end-to-end technology platform lifecycle—from early-stage process technology evaluation and foundry-partner collaboration to NPI enablement, and mass-production yield engineering.
 
Key Responsibilities:

• Technology Strategy & Evaluation: Architect and execute the technology roadmap for BCD and advanced power technologies. Evaluate and consolidate process technologies (Bulk, SOI, FinFET) based on product design needs, process features, schedule, cost, and figures of merit.
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Cross-Functional Leadership: Direct a large engineering organization (>150 members) encompassing Technology Development, Product Engineering, and Test Development.
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NPI Enablement & Risk Production: Drive complex product debug, process window characterization, and risk production ramp-up to deliver performance-competitive and cost-effective technologies that achieve strong product margins.
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Product & Yield Engineering Systems: Modernize operations by developing data-driven product engineering analysis tools and advanced analytics systems (including machine learning/deep learning applications) to minimize human error and automate failure analysis.
• Foundry Partnership & Collaboration: Act as the lead interface with premier global semiconductor foundries. Manage technology development partnerships, align PDKs, and drive the joint enablement of CMOS and Mixed-Signal/RF nodes.
• Ecosystem Alignment: Foster close collaboration between IC design leads, test engineers, and foundry partners to accelerate time-to-market, improve product performance, and ensure first-pass silicon success.

 
Required Experience:

• 20+ years of extensive experience within semiconductor engineering organizations across both Fab (foundry/IDM) and Fabless environments.
• Deep technical understanding of BCD process integration, device physics, and structural requirements needed to realize state-of-the-art power semiconductor devices for AI infrastructure or automotive systems.
• 10+ years in a progressive leadership role, heading multiple engineering teams with a minimum of 50+ engineers; Experience working or collaborating cross-borders (e.g., US, Taiwan, Japan) with diverse, world-class technical engineering units.
• A definitive track record of successfully delivering advanced process nodes from development into high-volume manufacturing.
• Proven capability in leading foundry engineering teams or working internally as a process integration lead at major foundries (e.g., TSMC, UMC, GlobalFoundries), with a deep understanding of foundry operations and technical boards.
• Ph.D. or Master’s degree in Electronics, Electrical Engineering, Physics, Computer Science, or a closely related engineering field.

For more information and confidential conversation, please email your CV to Janet.Yeh@morganphilips.com. Please note, that while Morgan Philips welcomes and appreciates all candidate response, volume of replies allows us to respond to short-listed candidates only. Resumes are collected for recruitment purposes only.