Advanced Package Engineer

【Job Responsibilities】

1. Collaborate with the Design & Development and Design Verification departments to develop and introduce new packaging processes.

2. Partner with the Production department to resolve packaging anomalies and maintain stable manufacturing yields.

3. Establish and define standard operating procedures (SOPs) for products and manufacturing processes.

4. Manage outsourced vendors and OSAT partners.

【Other Requirements】

1. Proven experience in packaging processes, WLCSP design and assembly, and Flip Chip packaging.

2. Hands-on experience with RDL and Bumping related manufacturing processes.

3. Solid experience in advanced packaging technologies, including 2.5D, 3D, Chip-on-Wafer (CoW), and Wafer-on-Wafer (WoW).

4. Experience in back-end WLCSP manufacturing processes.