Power Device Design Engineer (Silicon and SiC)

Position Overview

We are seeking an experienced and driven Power Device Design Engineer to lead the architecture, design, and optimization of advanced Silicon and Silicon Carbide (SiC) Power MOSFETs. In this role, you will work at the forefront of power semiconductor technology, collaborating with cross-functional teams to bring high-performance devices from concept to high-volume manufacturing.

Key Responsibilities

• Device Design & Optimization: Drive the electrical and structural design of Silicon and/or SiC Power MOSFETs optimized for high-efficiency power conversion across diverse voltage ranges.

• Simulation & Verification: Utilize TCAD, SPICE, finite element analysis (FEA), and layout tools for rigorous device physics simulation, electrical performance evaluation, and layout verification.

• Cross-Functional Collaboration: Partner closely with Process Integration, Layout, Product Engineering, and QRA (Quality, Reliability, and Assurance) teams to accelerate new product introductions (NPI) and support mass production ramp-up.

• Technical Documentation: Author comprehensive technical specifications, design reports, and present updates during key project milestone reviews.

• Customer Technical Support: Provide expert-level technical insights to address complex customer application inquiries and design-in challenges.

Qualifications & Requirements

• Education: Master’s degree or Ph.D. in Electrical Engineering, Electronics, Materials Science, Physics, or a related technical discipline.

• Experience: 5+ years of hands-on industry experience in Power MOSFET or discrete semiconductor device design.

• Technical Mastery: Demonstrated proficiency in TCAD simulation software (e.g., Synopsys Sentaurus or Silvaco).

Preferred Qualifications

• Architecture Expertise: Proven background in designing Trench, Planar, or Shielded Gate Trench (SGT) structures, as well as integrated ESD protection mechanisms.

• Manufacturing & Foundry Experience: First-hand experience driving products through mass production ramp-up or successfully managing wafer foundry tape-outs and collaborative projects.

• Application Exposure: Prior involvement in developing solutions tailored for automotive (AEC-Q) or demanding industrial power applications.

• Simulation Tools: Familiarity with SPICE circuit modeling and multi-physics finite element analysis tools such as COMSOL or Ansys.