(Account) General Manager, Advanced Packaging
發佈於： 2026/9/7
Hsinchu Northern Taiwan
Permanent
半導體
Confidential Search - We’re seeking a highly accomplished (Account) General Manager, Advanced Packaging, for a leading multinational semiconductor company to drive strategic growth initiatives and customer engagement in the Advanced Packaging business. Reporting directly to the Corporate Vice President, this executive-level, newly created role will lead Taiwan-based Sales & Technical Support teams serving premium advanced wafer-level packaging, OSAT, and top Memory manufacturing accounts.
The ideal candidate brings deep technical expertise in semiconductor advanced packaging processes, proven commercial acumen, and an established supply chain network. This leader will collaborate closely with global product leaders and executive management; exceptional communication and presentation skills in both English and Mandarin Chinese are required. A strong technical background paired with extensive P&L management experience is highly desirable.
Key Responsibilities
• Strategic Account Management & Commercial Leadership: Formulate and execute multi-year commercial strategies to expand market share and drive revenue growth in the Advanced Packaging space. Own regional P&L performance for target accounts.
• Team Leadership & Matrix Alignment: Lead, mentor, and build high-performing local Sales and Field Application/Technical Support teams. Partner closely with global Product Managers and cross-functional leadership to align product roadmaps with local market demand.
• Ecosystem & Client Engagement: Build and leverage high-level relationships across key decision-makers at foundries, OSATs, and leading Memory manufacturers in Taiwan.
• Technical Integration & Solutions Delivery: Translate complex customer requirements (e.g., 2.5D/3D integration, fan-out wafer-level packaging, substrate/interposer tech) into actionable technical service strategies and product requirements.
• Executive Communication: Deliver strategic business reviews, technology updates, and commercial proposals to both executive-level clients and internal C-suite stakeholders in English and Mandarin.
Desired Qualifications
• End-to-end Advanced Packaging expertise: 15+ years in the related industry sector with a solid understanding of Advanced Packaging processes, spanning from Front-end wafer fabriacation to advanced Backend Integration.
• Deep understanding of core packaging technologies (e.g., CoWoS, InFO, FOCoS, SoIC) and their trade-offs in yield, warpage, and thermal budget. Proven ability to integrate front-end capabilities, assembly operations, and the broader supplier ecosystem into solution selling.
• Proven track record in executive-level sales, technical, or general management roles with direct P&L responsibility and team leadership experience.
• Network & Market Presence: Established, senior-level network within the Taiwan semiconductor supply chain (top foundries, OSATs, memory suppliers).
• Exceptional commercial acumen, executive presentation skills, and the ability to navigate complex global matrix organizations.
• Professional fluency in both written and spoken English and Mandarin Chinese.
• Bachelor’s degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or related technical field (Master's or Ph.D. preferred; MBA is a plus).
For more information and a confidential conversation, please email your CV to Janet.Yeh@morganphilips.com. Please note, that while Morgan Philips welcomes and appreciates all candidate response, volume of replies allows us to respond to short-listed candidates only. Resumes are collected for recruitment purposes only.
The ideal candidate brings deep technical expertise in semiconductor advanced packaging processes, proven commercial acumen, and an established supply chain network. This leader will collaborate closely with global product leaders and executive management; exceptional communication and presentation skills in both English and Mandarin Chinese are required. A strong technical background paired with extensive P&L management experience is highly desirable.
Key Responsibilities
• Strategic Account Management & Commercial Leadership: Formulate and execute multi-year commercial strategies to expand market share and drive revenue growth in the Advanced Packaging space. Own regional P&L performance for target accounts.
• Team Leadership & Matrix Alignment: Lead, mentor, and build high-performing local Sales and Field Application/Technical Support teams. Partner closely with global Product Managers and cross-functional leadership to align product roadmaps with local market demand.
• Ecosystem & Client Engagement: Build and leverage high-level relationships across key decision-makers at foundries, OSATs, and leading Memory manufacturers in Taiwan.
• Technical Integration & Solutions Delivery: Translate complex customer requirements (e.g., 2.5D/3D integration, fan-out wafer-level packaging, substrate/interposer tech) into actionable technical service strategies and product requirements.
• Executive Communication: Deliver strategic business reviews, technology updates, and commercial proposals to both executive-level clients and internal C-suite stakeholders in English and Mandarin.
Desired Qualifications
• End-to-end Advanced Packaging expertise: 15+ years in the related industry sector with a solid understanding of Advanced Packaging processes, spanning from Front-end wafer fabriacation to advanced Backend Integration.
• Deep understanding of core packaging technologies (e.g., CoWoS, InFO, FOCoS, SoIC) and their trade-offs in yield, warpage, and thermal budget. Proven ability to integrate front-end capabilities, assembly operations, and the broader supplier ecosystem into solution selling.
• Proven track record in executive-level sales, technical, or general management roles with direct P&L responsibility and team leadership experience.
• Network & Market Presence: Established, senior-level network within the Taiwan semiconductor supply chain (top foundries, OSATs, memory suppliers).
• Exceptional commercial acumen, executive presentation skills, and the ability to navigate complex global matrix organizations.
• Professional fluency in both written and spoken English and Mandarin Chinese.
• Bachelor’s degree in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or related technical field (Master's or Ph.D. preferred; MBA is a plus).
For more information and a confidential conversation, please email your CV to Janet.Yeh@morganphilips.com. Please note, that while Morgan Philips welcomes and appreciates all candidate response, volume of replies allows us to respond to short-listed candidates only. Resumes are collected for recruitment purposes only.