Engineering Lead (Test, Product, & Reliability)

Role Overview

We are seeking a high-caliber Operations Engineering Lead to spearhead our in-house and subcontracted manufacturing functions. This pivotal role involves overseeing Test, Product, and Reliability Engineering to develop and manufacture complex SoC/SiP devices on leading-edge process and package technologies. As a key leader for a premier provider of AI security and power management solutions, you will drive the technical lifecycle of our products from initial concept through high-volume manufacturing (HVM).

Core Responsibilities

• Lifecycle Management: Lead technical manufacturing for both chips and boards, encompassing design, prototyping, qualification, HVM release, and ongoing sustaining support.

• Internal Collaboration: Partner with the Engineering team on new product development, focusing on DFT/DFM, package design, ATE test HW/SW development, and yield enhancement.

• Supply Chain Integration: Coordinate externally with the global supply chain, including foundries (Fab), assembly houses, and test facilities to drive failure analysis and cost reduction.

• Operational Excellence: Work alongside production planning to ensure seamless order fulfillment and consistent on-time delivery.

• Quality Leadership: Support corporate quality objectives by implementing scalable processes for high-volume products, managing customer RMA/FA processes, and maintaining ISO certifications.

Qualifications & Requirements

• Educational Background: BS or MS in Electrical Engineering or a related discipline focusing on advanced semiconductor technology.

• Industry Expertise: Minimum of 10 years of experience in the semiconductor industry, with a proven track record as both a technical individual contributor and a team manager.

• Technical Mastery: Deep experience with ATE test methodology and programming specifically on the Advantest 93K platform (including HW, SW, patterns, and debugging).

• Hands-on Skills: Must possess direct experience in ATE test development, DFT, high-speed testing, and a solid understanding of device physics.

• Preferred Skills: Familiarity with SLT (System Level Test) for SiP/boards, and expertise in the yield/reliability of submicron CMOS and FinFET technologies.

Professional Attributes

• Communication: Exceptional communication skills with experience managing international, cross-functional projects and resources.

• Mindset: A self-motivated, analytical, and detail-oriented professional with high personal integrity.

• Adaptability: Ability to remain agile and resourceful while managing ambiguity and executing tasks in a fast-paced environment.

• Mobility: Willingness to travel (approximately 10–20%) to support global operations.