Process Integration Engineering Manager

Responsible for defining process integration roadmaps, driving aggressive yield enhancement, and ensuring manufacturing stability. This role is critical in bridging the gap between technology development and high-volume manufacturing to ensure seamless product ramp-up and superior quality standards.

Key Responsibilities

• Strategic Leadership & Planning Lead and mentor the engineering team to define long-term process strategies, platform planning, and future technology directions.

• Process Integration & Yield Excellence Drive cross-functional initiatives for process optimization and yield improvement to ensure successful production ramp-ups and cost-efficiency.

• Technical Decision-Making Act as the primary technical authority for resolving complex challenges related to device integration and wafer fabrication processes.

• Cross-Functional Collaboration Partner closely with Manufacturing, Equipment, Metrology, Quality, and Sales departments to align technical execution with business goals.

• Customer Engagement & NPI Provide high-level technical support for key customer engagements, including technical feasibility evaluations, New Product Introductions (NPI), and root-cause analysis for technical issues.

• Organizational Development Strategize team structure, optimize resource allocation, and cultivate technical talent to strengthen the organization’s execution capabilities and technical depth.

Required Skills and Qualifications

1. Education

• Master’s degree or above in Electrical Engineering, Electronic Engineering, Physics, or a related semiconductor field.

2. Professional Experience

• Industry Tenure: Minimum of 15+ years in the semiconductor industry.

• Functional Expertise: At least 10+ years of hands-on experience in Technology Development (TD) and/or Process Integration Engineering (PIE).

• Leadership: 5+ years of experience in a management role, leading engineering teams and making high-stakes technical decisions.

3. Technical Proficiency

Expert knowledge of semiconductor wafer fabrication processes, equipment, and metrology. Priority will be given to candidates with experience in multiple technology areas below:

• Power Management & Analog: BCD, HVCMOS, Bipolar IC.

• Power Discretes: Planar / Trench Schottky, FRED, Transistor, Zener.

• Optoelectronics: Photo Transistor, Photo Triac, PVG.

• Wide Bandgap Semiconductors: SiC (Silicon Carbide) devices.

4. Soft Skills & Languages

• Leadership: Strong sense of ownership and the ability to solve complex problems under pressure.

• Communication: Excellent interpersonal and cross-functional collaboration skills; proven ability to manage multiple complex projects independently.

• Languages: Fluency in English is highly preferred; proficiency in Japanese is a significant plus.