Technical Manager, Advanced Package

Position Summary

We are seeking an experienced and highly skilled Senior Manager to support R&D and customer engagement activities within our Advanced Packaging Technology Team. In this role, you will be responsible for driving key technology development programs, supporting customer evaluations, and serving as a primary technical interface to a tier-1 foundry's Advanced Packaging organization.

As part of one of our fastest-growing divisions, this position offers distinct opportunities to lead impactful engineering projects, collaborate with internal product units, and directly influence technology roadmaps through strong technical insight and customer advocacy.

Role Responsibilities

• Customer & Roadmap Engagement: Engage deeply with customers to understand their long-term roadmaps, interpret their technology needs, and identify key opportunities for technical engagement.

• Technology Adoption: Drive the adoption of new technology at the customer site utilizing hardware demos, on-site evaluations, joint development programs, and new tool qualifications.

• Business Unit Liaison: Serve as the primary liaison between the customer and internal business units for assigned projects, ensuring clear understanding of customer pain points and the delivery of applicable solutions.

• Lifecycle & Field Support: Lead teams in providing high-visibility customer support through on-site installations, system diagnoses, and the servicing/repair of complex systems and equipment.

• Process Development: Work closely with customers and internal R&D teams to develop leading-edge processes used to manufacture advanced semiconductor chips, covering technologies such as Chemical Vapor Deposition (CVD), Atomic Layer Deposition (ALD), Plasma Reactive Ion Etch, Physical Vapor Deposition (PVD), Anneal, and Implant.

• DOE & Statistical Analysis: Create hypothesis experiments and Design of Experiments (DOEs); analyze complex data with statistical tools; and compile reports with high-level conclusions on technically challenging process engineering experiments.

• Root Cause & Troubleshooting: Oversee the troubleshooting of complex problems, perform thorough root cause analyses (RCA), and resolve a variety of difficult process engineering and customer product issues.

• Continuous Improvement: Apply extensive knowledge of industry best practices, business challenges, and regulatory issues to identify innovative solutions and recommend structural improvements to processes or products.

Qualifications

• Education: Master’s degree in Materials Science, Chemical Engineering, Electrical Engineering, or a related technical field; a Ph.D. is highly preferred.

• Experience: 10+ years of semiconductor industry experience, with a strong preference for individuals possessing direct exposure to advanced packaging R&D or process integration.

• Leadership Track Record: Demonstrated success in technical project leadership, new technology evaluation, and high-level customer engagement.

• Cross-Functional Collaboration: Hands-on experience working alongside cross-functional engineering teams and driving complex, multi-layered technical programs to successful completion.

• Communication Skills: Strong communication skills with the ability to represent technical positions clearly to both internal stakeholders and customer engineers.

• Language Proficiency: Excellent verbal and written communication capability in both English and Mandarin.

• Travel: Ability and willingness to travel domestically and internationally as needed to support business objectives.