en
zh
“ MAKING SUCCESS STORIES HAPPEN ”
 

Position Overview

  • Title: Hardware Engineering Manager / Director (DirectFlash Modules)

  • Location: Hsinchu, Taiwan (In-Office / Hybrid)

  • Reports To: VP of Hardware Engineering / U.S. Architecture & Engineering Leadership

  • Scope: Executive leadership of the Taiwan hardware engineering organization, owning end-to-end execution, advanced board design, signal/power integrity, and high-volume manufacturing (HVM) ramp for enterprise storage hardware.

Executive Summary

We have been retained by a global leader in enterprise data storage and modern cloud infrastructure to identify a high-caliber Hardware Engineering Manager to lead their mission-critical engineering hub in Hsinchu, Taiwan.

In this pivotal leadership role, you will act as the technical anchor in Taiwan, bridging advanced hardware development between local engineering labs and U.S.-based architecture teams. You will drive the execution of next-generation DirectFlash Modules (DFMs)—custom flash storage hardware powering top-tier hyperscale platforms. This is a rare, high-impact opportunity for a seasoned engineering leader to own end-to-end product delivery, scale a world-class R&D team, and shape the physical infrastructure powering next-generation cloud architecture.

Key Responsibilities

1. Technical & Organizational Leadership

  • Lead, mentor, and scale a multi-disciplinary engineering organization spanning hardware design, high-speed interfaces (PCIe), signal and power integrity (SI/PI), and system validation in Hsinchu.

  • Foster a culture of high accountability, technical excellence, and cross-functional collaboration, establishing clear career development pathways for top engineering talent.

2. End-to-End Product Lifecycle Ownership

  • Drive the DFM hardware and mechanical lifecycle from early architectural feasibility and schematic capture through board bring-up, EVT/DVT phases, root-cause failure analysis, and on-schedule high-volume production release.

  • Ensure seamless alignment between hardware design milestones and overarching firmware, test, and product engineering schedules.

3. Hardware Validation & Quality Engineering

  • Establish rigorous qualification standards, integrating automated test benches, stress testing, and systematic coverage reviews to accelerate root-cause analysis and eliminate field escapes.

  • Champion Design-for-Manufacturing (DFM) and Design-for-Test (DFT) best practices across all engineering stages.

4. Ecosystem & Cross-Continental Orchestration

  • Serve as the principal technical liaison between U.S. architecture teams, flash controller vendors, tier-one contract manufacturers (CMs/ODMs), and hyperscale system integrators.

  • Resolve complex cross-functional hurdles spanning multiple international time zones to ensure flawless execution and volume ramps.

Candidate Profile & Requirements

Professional Experience

  • 10+ years of progressive hardware engineering experience within enterprise storage, server architectures, or hyperscale hardware development, with at least 3–5 years in a direct people-management or technical leadership role leading hardware teams.

  • Proven track record of successfully guiding complex enterprise-grade hardware products from concept through high-volume manufacturing (HVM).

Technical Mastery

  • Hands-on domain expertise in high-speed board design, advanced PCIe architectures, thermal management, and comprehensive signal integrity / power integrity (SI/PI) methodologies.

  • Deep familiarity with enterprise flash storage media, controller ecosystems, and server motherboard integration.

Leadership & Soft Skills

  • Exceptional cross-cultural communication skills with a proven ability to align distributed engineering stakeholders across the U.S. and APAC time zones.

  • Fluent in professional English and Mandarin, with a polished, consultative, and executive-level leadership style suited for top-tier multinational environments.

Remuneration & Rewards

  • Competitive Compensation Package: Base salary, performance-based annual bonus, and equity/RSU components designed to attract top-tier executive talent.

  • Work Environment: Located in the heart of Taiwan’s technology hub in Hsinchu, featuring state-of-the-art lab facilities, flexible workplace policies, and comprehensive health and wellness benefits.

Apply for Hardware Manager (PCIE)
Reference: GC880441

Please complete all required fields marked *

*

*

*

*

*

MS Word, PDF, HTML and Txt formats.

Issues applying with LinkedIn? Click here

*
Your personal details, submitted whilst completing this form, will be treated conform our Privacy Notice and Terms & Conditions .
I accept the Morgan Philips Privacy Notice and Terms & Conditions.

Hardware Manager (PCIE)
Hsinchu, Northern Taiwan | Permanent