6 半導體 職務 台灣
Kaohsiung, Southern Taiwan Permanent
發佈於： 2026/3/10
As the Equipment Engineering Manager , you will be responsible for building a high-performance team and executing the global strategy for the acquisition, startup, and optimization of custom manufacturing equipment. You will bridge the gap between demand planning and operational execution for both new and existin...
Taipei, Northern Taiwan Permanent
發佈於： 2026/3/3
We are seeking a high-caliber, results-driven Account Manager to join our major accounts team. This is a high-impact role where you will bridge the gap between cutting-edge technology and market-leading revenue growth. We are looking for an "aggressive-growth" professional—whether your background is in Sales, P...
Hsinchu, Northern Taiwan Permanent
發佈於： 2026/3/2
We’re looking for a senior Device Lead for a leading fabless company based in Hsin-Chu. This is a managerial role of a Device Engineering team (HV/BCD), reporting to the Senior Director of Technology Development & Product Engineering. Experience and deep understanding of BCD process technology and LDMOS device phy...
Hsinchu, Northern Taiwan Permanent
發佈於： 2026/2/26
Confidential Search – We’re looking for a seasoned Site General Manager (GM) or Deputy GM for one of the leading Semiconductor Foundry companies. This is a high-level senior leadership role responsible for the end-to-end operatins of a semiconductor fabrication plant (Fab). This includes managing massive capital e...
Hsinchu, 台灣 Permanent
發佈於： 2026/2/25
Job Title : HRBP Senior Manager Reports to: Country HR Head Location: Hsinchu Our client in this search is a global leading technology company Role: Strategic HR Partner leader in Taiwan HR Organization who will report to Taiwan Country HR Head directly. This person will be a strategic HR p...
Hsinchu, Northern Taiwan Permanent
發佈於： 2026/2/24
【Position Summary】 We are seeking a seasoned and visionary (Sr.) Technical Director to lead R&D efforts within our Advanced Packaging Technology Team . This high-impact leadership role drives the development and optimization of next-generation packaging technologies, serving as the primary technical inter...