Our client is a global semiconductor innovator developing next-generation AI, high-performance computing, and optical interconnect technologies. The company is investing heavily in advanced packaging, heterogeneous integration, and Co-Packaged Optics to enable future data center and networking platforms. The position offers direct exposure to cutting-edge packaging technologies and close collaboration with leading foundries, OSATs, and ecosystem partners worldwide.

About the Opportunity

We are seeking an experienced semiconductor packaging professional to lead the development and industrialization of next-generation heterogeneous integration and Co-Packaged Optics (CPO) technologies. This role will drive advanced packaging innovation, collaborate with global ecosystem partners, and enable high-performance computing, AI, and next-generation connectivity solutions.

Key Responsibilities

Advanced Packaging Technology Development

• Lead technology evaluation, feasibility studies, and development of advanced packaging solutions, including:
  • Co-Packaged Optics (CPO)
  • 2.5D / 3D / 3.5D integration
  • Fan-Out packaging
  • Embedded bridge technologies
  • Wafer-level and panel-level packaging
  • Heterogeneous integration architectures
• Identify and assess emerging packaging technologies to support future product roadmaps.

New Product Introduction (NPI) & Yield Improvement

• Drive NPI activities from engineering validation through volume production.
• Develop process flows, design of experiments (DOE), qualification plans, and manufacturing strategies.
• Conduct yield analysis, root-cause investigations, and corrective actions to improve product performance and manufacturing efficiency.
• Partner with manufacturing teams to accelerate production ramp and optimize yields.

Packaging Solution Architecture

• Define and implement advanced packaging solutions for:
  • Optical modules and optical interconnects
  • Co-Packaged Optics platforms
  • High-bandwidth memory (HBM) integration
  • Logic-to-memory heterogeneous systems
  • Next-generation high-performance computing and AI applications
• Work closely with design teams to optimize package performance, manufacturability, reliability, and cost.

Ecosystem & Supply Chain Collaboration

• Engage with foundries, OSATs, substrate suppliers, optical component providers, and manufacturing partners.
• Evaluate supplier capabilities, technology readiness, cost structures, and production scalability.
• Support sourcing strategies and technology qualification activities across the supply chain.

Cross-Functional Project Leadership

• Lead cross-functional initiatives involving IC design, package design, test engineering, reliability, quality, and operations teams.
• Manage technology development schedules, risk assessments, and technical milestones.
• Ensure successful execution from concept to high-volume manufacturing.

---

Qualifications

Education

• Master's or Ph.D. degree in:
  • Electrical Engineering
  • Electronics Engineering
  • Materials Science
  • Physics
  • Chemistry
  • Mechanical Engineering
  • Or a related technical discipline

Experience

• 6+ years of experience in semiconductor packaging, process integration, NPI, packaging R&D, or technology management.
• Strong experience in one or more of the following areas is highly preferred:
  • Co-Packaged Optics (CPO)
  • Optical module assembly and testing
  • HBM integration
  • 2.5D / 3D advanced packaging
  • High-performance computing (HPC) packaging
  • AI accelerator packaging technologies

Technical Expertise

• Deep understanding of advanced packaging processes and manufacturing flows, including:
  • Flip-Chip
  • Wafer-Level Packaging (WLP/WLCSP)
  • Fan-Out Packaging
  • CoWoS
  • Embedded bridge technologies
  • Advanced interconnect and assembly processes
• Strong knowledge of DOE methodology, Failure Analysis (FA), process qualification, and tape-out execution.
• Familiarity with optical module design, photonics integration, or memory-package integration architectures.
• Understanding of Signal Integrity (SI), Power Integrity (PI), package reliability, and semiconductor failure mechanisms.
• Demonstrated ability to collaborate effectively across engineering, manufacturing, and external technology partners.

Preferred Attributes

• Strong technical leadership and project management skills.
• Experience working with globally distributed teams and suppliers.
• Ability to translate emerging technology concepts into manufacturable products.
• Excellent communication and stakeholder management capabilities.