Sr. Sustaining Engineer (OSAT Management)

Overview

We are looking for an experienced OSAT Management Sustaining Engineer based in Taiwan to support semiconductor manufacturing and supply chain operations. This role works closely with OSAT partners to ensure smooth production, capacity planning, inventory management, and on-time product delivery.

Key Responsibilities

• Monitor and manage OSAT forecasts, work-in-progress (WIP), and raw material inventory.
• Coordinate and drive production pull-ins when required to meet customer demand.
• Work with supply chain teams to track OSAT capacity and secure additional capacity for demand increases.
• Visit OSAT sites regularly to:
  • Support production ramp-ups
  • Resolve manufacturing and delivery issues
  • Participate in quality audits
  • Review supplier performance
  • Drive operational improvements
• Support engineering teams by managing engineering WIP and coordinating packaging and test operations.
• Track production cycle times and delivery performance, providing monthly and quarterly reports.
• Assist with foundry RMA (Return Material Authorization) activities within OSAT facilities.
• Support New Product Introduction (NPI) programs, including WIP movement and delivery coordination.

Required Qualifications

• Bachelor's degree in Engineering, Technology, Supply Chain, Business, or a related field.
• 5+ years of experience in semiconductor manufacturing, operations planning, or supply chain management.
• Strong understanding of semiconductor manufacturing and production planning processes.
• Excellent analytical and data interpretation skills.
• High level of integrity and professionalism in supplier management.
• Strong communication and stakeholder management skills.
• Proven ability to manage multiple priorities, projects, and deadlines.
• Ability to independently engage with supplier management teams to resolve issues and drive results.
• Experience using SAP for inventory management, WIP tracking, purchase requisitions, or lot management is a plus.

Preferred Qualifications

• Strong knowledge of semiconductor packaging and assembly processes.
• Understanding of packaging industry trends and customer requirements.
• Experience with WLCSP (Wafer Level Chip Scale Package) or related bumping technologies.
• Familiarity with JMP, AutoCAD, Gerber files, PCB design tools, or other engineering software.
• Knowledge of materials science and manufacturing process interactions.
• Experience with assembly tooling design and fabrication.
• Advanced degree in Engineering or a related technical field.