Vice President, Business Development - Asia Region
發佈於: 2026/5/13
Taipei or Hsinchu Northern Taiwan
Permanent
半導體
The ideal candidate will possess deep semiconductor manufacturing expertise, strong commercial acumen, and an established network across the Asia semiconductor supply chain. The successful leader will play a critical role in identifying new market opportunities, influencing both executive and working-level stakeholders, and closing complex, high-value business agreements.
Key Responsibilities
- Develop and execute regional business development strategies aligned with the company’s global growth objectives. Identify and pursue new revenue opportunities within semiconductor manufacturing, advanced packaging/OSAT, HPC silicon, and power semiconductor markets.
- Build and strengthen strategic relationships with key ecosystem partners, including wafer foundries, OSATs, IDMs/fabless semiconductor companies, and technology alliances.
- Serve as a senior commercial leader for strategic accounts, with strong emphasis on TSMC and related ecosystem partners. Drive account penetration strategies and coordinate cross-functional collaboration to maximize customer success and long-term partnership value.
- Drive design-in and Influence customer roadmaps by aligning company solutions with future technology and manufacturing trends.
- Maintain deep understanding of semiconductor backend processes, including wafer assembly, test, advanced packaging, heterogeneous integration. Track industry trends in AI, HPC silicon, advanced nodes, chiplets, and power semiconductor applications.
- Collaborate closely with engineering, product management, and executive leadership teams to support strategic initiatives and customer requirements. Navigate capacity planning, pricing, and advanced packaging strategies.
Required Qualifications
- Minimum 20+ years of experience within the semiconductor manufacturing industry. Proven experience managing or supporting strategic wafer foundry accounts, particularly TSMC.
- Strong technical understanding of semiconductor backend manufacturing processes, advanced packaging, power semiconductor technologies, and/or High-Performance Computing (HPC) silicon.
- Demonstrated success influencing both executive and working-level stakeholders and closing complex, multi-million-dollar business agreements.
- Strong network within the Asia semiconductor ecosystem, including wafer foundries, OSATs, and fabless semiconductor companies.
- Familiarity with advanced packaging technologies such as CoWoS, 2.5D/3D integration, chiplet architecture, and heterogeneous integration.
- Experience working within a multinational semiconductor company.
- Excellent strategic thinking, negotiation, and leadership capabilities.
- High level of commercial and technical credibility; Results-driven with strong ownership mindset; Ability to thrive in a fast-paced, matrixed multinational environment.
- Fluent verbal and written communication skills in both English and Mandarin Chinese.
For more information and a confidential conversation, please email your CV to Janet.Yeh@morganphilips.com. Please note, that while Morgan Philips welcomes and appreciates all candidate response, volume of replies allows us to respond to short-listed candidates only. Resumes are collected for recruitment purposes only.
We’re seeking a highly accomplished Vice President of Business Development – Asia Region for a U.S.-based multinational semiconductor company to drive its strategic growth initiatives and customer engagement across the Asia semiconductor ecosystem. This executive-level role will focus on developing and expanding strategic partnerships with leading wafer foundries, OSATs, and IDM ecosystem players, with particular emphasis on TSMC account engagement and advanced semiconductor technologies.
The ideal candidate will possess deep semiconductor manufacturing expertise, strong commercial acumen, and an established network across the Asia semiconductor supply chain. The successful leader will play a critical role in identifying new market opportunities, influencing both executive and working-level stakeholders, and closing complex, high-value business agreements.
Key Responsibilities
- Develop and execute regional business development strategies aligned with the company’s global growth objectives. Identify and pursue new revenue opportunities within semiconductor manufacturing, advanced packaging/OSAT, HPC silicon, and power semiconductor markets.
- Build and strengthen strategic relationships with key ecosystem partners, including wafer foundries, OSATs, IDMs/fabless semiconductor companies, and technology alliances.
- Serve as a senior commercial leader for strategic accounts, with strong emphasis on TSMC and related ecosystem partners. Drive account penetration strategies and coordinate cross-functional collaboration to maximize customer success and long-term partnership value.
- Drive design-in and Influence customer roadmaps by aligning company solutions with future technology and manufacturing trends.
- Maintain deep understanding of semiconductor backend processes, including wafer assembly, test, advanced packaging, heterogeneous integration. Track industry trends in AI, HPC silicon, advanced nodes, chiplets, and power semiconductor applications.
- Collaborate closely with engineering, product management, and executive leadership teams to support strategic initiatives and customer requirements. Navigate capacity planning, pricing, and advanced packaging strategies.
Required Qualifications
- Minimum 20+ years of experience within the semiconductor manufacturing industry. Proven experience managing or supporting strategic wafer foundry accounts, particularly TSMC.
- Strong technical understanding of semiconductor backend manufacturing processes, advanced packaging, power semiconductor technologies, and/or High-Performance Computing (HPC) silicon.
- Demonstrated success influencing both executive and working-level stakeholders and closing complex, multi-million-dollar business agreements.
- Strong network within the Asia semiconductor ecosystem, including wafer foundries, OSATs, and fabless semiconductor companies.
- Familiarity with advanced packaging technologies such as CoWoS, 2.5D/3D integration, chiplet architecture, and heterogeneous integration.
- Experience working within a multinational semiconductor company.
- Excellent strategic thinking, negotiation, and leadership capabilities.
- High level of commercial and technical credibility; Results-driven with strong ownership mindset; Ability to thrive in a fast-paced, matrixed multinational environment.
- Fluent verbal and written communication skills in both English and Mandarin Chinese.
For more information and a confidential conversation, please email your CV to Janet.Yeh@morganphilips.com. Please note, that while Morgan Philips welcomes and appreciates all candidate response, volume of replies allows us to respond to short-listed candidates only. Resumes are collected for recruitment purposes only.
We’re seeking a highly accomplished Vice President of Business Development – Asia Region for a U.S.-based multinational semiconductor company to drive its strategic growth initiatives and customer engagement across the Asia semiconductor ecosystem. This executive-level role will focus on developing and expanding strategic partnerships with leading wafer foundries, OSATs, and IDM ecosystem players, with particular emphasis on TSMC account engagement and advanced semiconductor technologies.
The ideal candidate will possess deep semiconductor manufacturing expertise, strong commercial acumen, and an established network across the Asia semiconductor supply chain. The successful leader will play a critical role in identifying new market opportunities, influencing both executive and working-level stakeholders, and closing complex, high-value business agreements.
Key Responsibilities
- Develop and execute regional business development strategies aligned with the company’s global growth objectives. Identify and pursue new revenue opportunities within semiconductor manufacturing, advanced packaging/OSAT, HPC silicon, and power semiconductor markets.
- Build and strengthen strategic relationships with key ecosystem partners, including wafer foundries, OSATs, IDMs/fabless semiconductor companies, and technology alliances.
- Serve as a senior commercial leader for strategic accounts, with strong emphasis on TSMC and related ecosystem partners. Drive account penetration strategies and coordinate cross-functional collaboration to maximize customer success and long-term partnership value.
- Drive design-in and Influence customer roadmaps by aligning company solutions with future technology and manufacturing trends.
- Maintain deep understanding of semiconductor backend processes, including wafer assembly, test, advanced packaging, heterogeneous integration. Track industry trends in AI, HPC silicon, advanced nodes, chiplets, and power semiconductor applications.
- Collaborate closely with engineering, product management, and executive leadership teams to support strategic initiatives and customer requirements. Navigate capacity planning, pricing, and advanced packaging strategies.
Required Qualifications
- Minimum 20+ years of experience within the semiconductor manufacturing industry. Proven experience managing or supporting strategic wafer foundry accounts, particularly TSMC.
- Strong technical understanding of semiconductor backend manufacturing processes, advanced packaging, power semiconductor technologies, and/or High-Performance Computing (HPC) silicon.
- Demonstrated success influencing both executive and working-level stakeholders and closing complex, multi-million-dollar business agreements.
- Strong network within the Asia semiconductor ecosystem, including wafer foundries, OSATs, and fabless semiconductor companies.
- Familiarity with advanced packaging technologies such as CoWoS, 2.5D/3D integration, chiplet architecture, and heterogeneous integration.
- Experience working within a multinational semiconductor company.
- Excellent strategic thinking, negotiation, and leadership capabilities.
- High level of commercial and technical credibility; Results-driven with strong ownership mindset; Ability to thrive in a fast-paced, matrixed multinational environment.
- Fluent verbal and written communication skills in both English and Mandarin Chinese.
For more information and a confidential conversation, please email your CV to Janet.Yeh@morganphilips.com. Please note, that while Morgan Philips welcomes and appreciates all candidate response, volume of replies allows us to respond to short-listed candidates only. Resumes are collected for recruitment purposes only.